Thermal conductivity bilongsilikon spons geli stap namel long 0.8-12 W/mK (gradient yu ken senisim: 1/2/3/5/8 W/mK)
Tempereja resistans: -60 digri i go long 230 digri ; Sanpu fomulasen i save sanap strong long sotpela taim eksposesen inap long 315 digri.
Thermal conductivity bilongpoliureten fomi stap namel long 0.5 i go inap 4 W/mK
Tempereja resistans: -40 digri i go long 120 digri ; antap long 120 digri, ol samting i save go lapun, kamap stiki, na lusim ol liklik molekiul.
Thermal conductivity of Thermal-conductiveEVA fomplanti taim long 0.5-3 W/mK
Mak bilong tempereja resistens bilong 'thermal-conductive EVA foam' em -30 digri i go inap 80 digri; Taim tempereja i antap long 80 digri, ol samting bilong EVA Foam bai kamap malumalum na senis
Thermal conductivity range bilongThermal-conductive EPDM raba fomem i 0.6-2.5 W/mK
Tempereja tolerans bilong EPDM fom i stat long -50 digri i go inap 150 digri
Ol mak bilong Thermal-conductivePE/XPE fomi stap namel long 0.4 i go inap 2 W/mK
Tempereja tolerans bilong PE/XPE fom i save stap namel long -20 digri i go inap 75 digri